Closer hardware systems bring the future of artificial intelligence into view

Research

View list of research

小林先生_750-500.png

Researchers from the Institute of Industrial Science at The University of Tokyo, Kobe Steel, Ltd, and Kobelco Research Institute, Inc, develop high-density, energy-efficient 3D embedded RAM for artificial intelligence applications.

2021.06.01

Press Release

Closer hardware systems bring the future of artificial intelligence into view

Related Researchers

KOBAYASHI Masaharu Associate Professor

Integrated Nanoelectronics

Department of Informatics and Electronics

Electrical Engineering and Information Systems : Graduate School of Engineering