A cool fix for hot chips: advanced thermal management technology for electronic devices

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三次元マイクロ流路で半導体チップの省エネ水冷を実現（1200_800）.jpg

Researchers from the Institute of Industrial Science, The University of Tokyo, have demonstrated a significant performance increase in cooling technology for high-power electronic devices. They designed novel capillary geometries that push the boundaries of thermal transfer efficiency. This study could play a crucial role in the development of next-generation technology.

2025.04.14

Press Release

A cool fix for hot chips: advanced thermal management technology for electronic devices

Researchers #UTokyo_IIS have achieved a significant performance increase for cooling technology in high-power electronics, which could be fundamental for future devices.

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