Research Fields

Development and Applications of Submicron Secondary Ion Mass Spectrometer


2.c Development of a Three-Dimensional Microanalysis Method Using Ion and Electron Dual Focused Beams

We are developing a novel three-dimensional microanalysis method using a focused ion beam (FIB) and a finely-focused electron beam (EB). Our method employs an FIB as a micro-crosssectioning tool and an EB as a probe for sanning Auger electron microscope (SAM). Targets of the 3D-analysis are individual microparticles and ICs.

Conventional 3D-analysis is performed with the combination of ion beam etching using raster scan mode and the lateral mapping of the crater bottom. In this case, it is very difficult to obtain the 3D-elemental map of single particulate sample because of the uneven erosion caused by the incident angle dependence of sputtering yields.

In our method, the lateral mapping is performed not on a crater bottom but a planar cross-section etched with a slowly-scanned FIB. As shown in the figure, a 3D-elemental map of a particle is obtained with the repetition of the cross-sectioning and the elemental mapping of the cross-section. We have previously shown that the topographic effect can be negligible in this slow scan mode, named Shave-off scan.

Another aim of the dual beam concept is a new electron post-ionization technique to improve the sensitivity and quantification of FIB-SIMS. In order to obtain high post-ionization yields, we plan to perform the simultaneous bombardment of the FIB and the EB on the same spot on a sample surface.

In order to realize these two analysis modes, we are developing an ion and electron dual focused beam apparatus.


Illustration of the three-dimensional analysis of a particle (left)
and photograph of the ion and electron dual focused beam apparatus(right)

Overview of the Dual Focused Beam Apparatus


Experimental Results




Produced by Tetsuo SAKAMOTO : tsakamo@iis.u-tokyo.ac.jp